Ma, Yue, <br/><br/>
Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement / 
Yue Ma and Christian Gontrand. 
 - xiii, 226 pages :  ill. 
<br/><br/>Includes bibliographical references and index. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Three-dimensional integrated circuits.
<br/><br/><label>Dewey Class. No.: </label>621.381531  / M111 2019