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  <titleInfo>
    <title>Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement</title>
  </titleInfo>
  <name type="personal">
    <namePart>Ma, Yue</namePart>
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  <name type="personal">
    <namePart>Gontrand, Christian</namePart>
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    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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  <physicalDescription>
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    <extent>xiii, 226 pages : ill.</extent>
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  <note type="statement of responsibility">Yue Ma and Christian Gontrand.</note>
  <note>Includes bibliographical references and index.</note>
  <subject authority="lcsh">
    <topic>Three-dimensional integrated circuits</topic>
  </subject>
  <classification authority="ddc">621.381531 M111 2019</classification>
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    <recordCreationDate encoding="marc">250424</recordCreationDate>
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